Used ASM AB 520A #9257483 for sale

ASM AB 520A is an automated thermocompression bonder designed for mass production for printed circuit board (PCB) assembly. It provides high production speeds and precision with minimal set-up time. AB 520A's thermocompression bondhead creates strong bonds between the components and substrate which provide a long-term reliable connection. The equipment has an intuitive user-friendly interface which allows users to quickly setup and operate the bonder. ASM AB 520A has a standard hardware configuration, consisting of two fluxing stations and four alignment stations. The fluxing stations allow for precise and consistent flux application to ensure each bond has the optimum conditions. The alignment stations allow for precise location of components so that the bonder can create consistent, tight bonds. Once components have been loaded and the fluxer has been applied, AB 520A uses its advanced vision system to locate and align the parts for bonding. The vision unit includes a high-resolution color camera for capturing images of the parts and components, which is used to precisely calculate the position of each component. Furthermore, it has an array of powerful image processing algorithms and algorithms that enable the bonder to identify even the smallest of defects. Once a part is located and aligned, the bondhead applies the right amount of pressure and temperature to create a reliable and secure bond. The bondhead uses an automated PC-based control machine which allows for precise control and adjustment of the bonder's parameters. Additionally, the bonder comes with an emergency stop button, allowing the operator to easily stop the bonder if any issue is encountered. ASM AB 520A also has several safety features known as "design for safety". These features include a shielded cabinet, contactless bonds, pressure switch, and safety interlocks. This ensures the operator's safety and that no electric, chemical, or environmental hazards are present. In summary, AB 520A bonder is an automated thermocompression bonder designed for PCB assembly. It has an optimized process that enables quick and precise bonding of components on PCBs, while allowing for precise control of the bonding parameters with an advanced vision tool and automated control asset. The bonder also has several safety features that ensure the safety of the operator.