Used ASM AB 520A #9303885 for sale

ASM AB 520A is an automated wire bonding machine designed for producing wire connections for semiconductor packages. It is capable of performing various wire bonding applications such as ball bonding, wedge bonding, and loop bonding. This machine is primarily used in the assembly of electronic circuit packages for microelectronics. AB 520A features compatible software, user-friendly software, and simple set-up on a Standard Operator Interface (SOI). Its robust construction and high-precision servo-motors make it ideal for producing precise and efficient wire bonds. ASM AB 520A is equipped with an operational ex-factory software which is adjustable for different package types, including chip-scale, traditional, flip chip, and high density packages. It also features the ability to modify parameters, such as bond speed and pressure, to ensure high quality bonds. In addition, the machine has an integrated dynamic splice detection system, which is designed to detect potentially flawed or failed splices, thereby reducing the risk of product failure and ensuring the highest possible yield. The machine is composed of several parts, including a Bondhead, mounting platform, cantilever arm, traverse stage, and various sensors. The Bondhead is a thermal pressure based system capable of preforming wire bonds from 0.2 to 12 mils. The mounting platform allows for the vertical and horizontal positioning of the wire bonds, and the cantilever arm provides access to wire loading and non-contact bond verification. The traverse stage enables precise wire loading and twisting, and is equipped with auto-tensioning and displacement sensors. AB 520A is capable of producing high quality bonds with superior reliability. It is also flexible and cost effective, and designed to minimize set-up time and maximize throughput. This system is suitable for use in a wide range of industries, including automotive, medical, electronics, and telecommunications.