Used ASM AB 525 #9392280 for sale

ASM AB 525 is an advanced automated flip chip bonder designed for use in the manufacture of fine pitch and fine bond applications. This bonder is suitable for all forms of flip chip applications including fine pitch, fine bond, fine bump, fine wire bonding and solder ball attach applications. AB 525 features a right angle, 5-axis equipment with an embedded control cabinet-unique among flip chip bonders. This unique feature allows the bonder to reach SMT and non-SMT components without compromising accuracy or repeatability. The five axes of ASM AB 525 allows for flexible access to the surfaces of components and includes features such as a robotic arm, which is capable of controlling the exact placement of device components with accuracy and repeatability. This robotic arm can also be used to facilitate the movement of components from pallets and from one process location to another. The robot arm also allows the machine to pick up and reposition components while its bonding head is still in operation. AB 525 is also capable of providing extremely high bond accuracy and repeatability. It features a high resolution vision system, which allows its bonding head to scan for, and recognize, the correct component surface locations and profile. Additionally, its automated alignment unit ensures that all mounted components are aligned with the desired sites at the exact predetermined angles. This accuracy is achieved through a combination of 5-axis approach, independently variable feed speeds, precision vision and vacuum pressure. Additionally, ASM AB 525 is fitted with an advanced bonding head. This bonding head makes use of miniature buss bars, which create excellent electrical connections with very low power or current needs. Its heating elements enable rapid heating and cooling during the component bonding stage. Its adjustable height and further positional accuracy enable the bonder to set the precise position of each device component with highly repeatable accuracy. Finally, AB 525 also features a sophisticated control machine. This control tool ensures that operators are always in control of their bonder, permitting the use of fully automated processes and allowing the operator to check the bonder's operation from a remote location. In conclusion, ASM AB 525 is an advanced automated flip chip bonder designed for fine pitch and fine bond applications. It features five axes of precision and an embedded control asset for complete control and accessibility. Additionally, AB 525 is fitted with a highly accurate vision model bonded to an intelligent robot arm, as well as miniature buss bars and heated elements. This advanced bonder is perfect for all areas of fine pitch and fine bond applications.