Used ASM AB 530 #293812632 for sale

Manufacturer
ASM
Model
AB 530
ID: 293812632
Vintage: 2015
Wire bonder 2015 vintage.
ASM AB 530 is an advanced fully automated die bonder. It is designed for the semiconductor device packaging industry and offers best-in-class accuracy and repeatability. ASM AB530's integrated heat-controlled Bond Head delivers reliable results while its Modular Offline User Interface (MOUI) allows operators to customize their application-specific process steps. AB 530 has a robust mechanical frame and a reliable motion equipment with top mass stability and tight alignment tolerances. The bond head is free-floating, enabling it to compensate for different substrates, reduce process time and minimize thermal and mechanical damage. AB530 uses intuitive software to track, monitor and adjust process parameters in real time. This allows it to optimize motion control and thermal management for dynamic, challenging and process-critical conditions. ASM AB 530's advanced optics system ensures accurate, repeatable placement and bonding results. The unit features digital imaging capabilities, allowing users to define multiple fiducial and feature locations, which are then used as a reference point for X-Y placement adjustments. ASM AB530 also features vacuum placement and pick-and-place functions. Its vision calibration machine ensures proper alignment, positioning, and registration of components. AB 530 is equipped with advanced thermal and mechanical processes, allowing for the widest range of die attach materials, such as epoxies, alloys, metals, and solder. Its thermal process capability is able to provide exact temperature uniformity with highly accurate temperature control. The thermal profile is programmable by the user, allowing for optimization of heat dissipation in specific applications. AB530 has a wide standard scope of supply and a range of optional accessories to suit different applications and process steps. Users can also upgrade the tool over time, by adding accessories such as extra vision components, extended lead time control, benchmark tests and PC interfacing options.
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