Used ASM AB 530 #9384088 for sale

ASM AB 530 is a next generation semi-automatic bonding machine which is designed to increase the throughput and production rate of semiconductor devices. The machine is designed to meet the needs of both component manufacturing and assembly operations. It is equipped with a reliable bonding head which can quickly and accurately bond components to substrates. The bonding head can also be quickly and securely replaced for different types of bonding operations. ASM AB530 is capable of carrying out both flip-chip and wire bonding operations. This bonder offers a wide range of bonding parameters including up to 500 grams of force, a pressure of up to 10 bar, and temperatures of up to 500 degrees Celsius. It also has a temperature control equipment which can be set to maintain the desired temperature. These features enable the bonder to bond a wide variety of materials such as gold, silver, aluminum, and tin. AB 530 also has an onboard PLC control system which allows the operator to store and recall specific parameters and settings for different jobs. This allows the bonder to quickly and easily set up for specific tasks as well as to store default values for frequently-performed tasks. The control unit also allows the operator to adjust the speed and force of the bonding head, as well as the temperature of the heated tip. Multi Alignment Machine (MAS) is a unique feature of AB530 which was designed to increase production rates and throughput. This tool allows for the bonding head to automatically adjust its position to bond accurately to various substrate shapes and sizes. This asset can also be linked to vision systems which use cameras or other components to monitor the accuracy of the bonding operation. ASM AB 530 is a state-of-the-art bonding machine which is designed to increase throughput and production rates while providing accuracy and dependability. The onboard control model and MAS makes it possible to quickly and easily adjust the speed and force of the bonding head as well as the temperature of the heated tip in order to bond a variety of materials. This combination of features makes ASM AB530 the perfect choice for those who are looking for a reliable and accurate solution for their bonding needs.