Used ASM AB 530 #9384543 for sale

ASM AB 530 is a high pressure die bonder, used to assemble integrated circuits (ICs) and other components to semiconductor wafers and substrates. This technology works by joining two components - such as a chip package and substrate - together with a thermally-resistant metal alloy or solder. ASM AB530 offers an efficient way to perform accurate high pressure bonding processes. AB 530 is a modular bonder, allowing for different processes to be automated and tailored to the user's requirements. It has a high-precision, self-centering ring chuck, which makes it ideal for a range of applications such as die attach, flip chip, wire bonding, MEMS packaging, and more. The chuck holds the substrate in place while an advanced force control equipment applies the correct pressure to the components being joined. This ensures that each component is attached correctly and securely. AB530 is designed to be intuitively used and controlled. It features an advanced user interface with optional interactive graphical programming. The interface allows users to monitor the process from start to finish and make any necessary adjustments quickly and easily. The process is also highly automated, featuring a closed loop control system that maintains accuracy and repeatability. ASM AB 530 is designed for heavy duty operation and is built with a rugged construction. It is robustly designed to be vibration and shock resistant, ensuring that the bonder is ready for long production runs. It is also equipped with a variety of safety features, including a pressurized chamber, automatic restrictor plate, and auto shut-off unit. In summary, ASM AB530 is a high pressure die bonder designed for use with ICs, substrates, and other components. It has a self-centering ring chuck, advanced force control machine, and intuitive user interface with optional interactive graphical programming. It is also highly automated and equipped with a variety of safety features, making it highly reliable and robust.