Used ASM AB 530 #9402557 for sale

ASM AB 530 is a high-performance bonder designed specifically for the semiconductor industry. It is a medium-sized automatic bonder that utilizes a variety of interchangeable bonding tools. ASM AB530 is an automated system that can be quickly changed from one bonding tool to the next. It is ideal for the production of medium sized devices, such as capacitors, resistors, Bluetooth modules and similar components. AB 530 utilizes a precision XY-table for accurately placing the various components being bonded onto the substrate. It is equipped with a motorized Z-axis tool holder which permits both vertical and horizontal tool movement. A high resolution camera is also provided, allowing for exact inspection and placement before bonding. AB530 boasts a wide range of supported bonding tools including dual thermal and ultrasonic wire bonder, wedge bonder, loop bonder and ball bonder. It also features a sophisticated programmable logic controller (PLC) that use pre-defined parameter and sequence settings to ensure repeatable, high quality bonding results. ASM AB 530 utilizes an advanced process monitoring system that provides reliable performance during the entire bonding cycle and provides feedback on the parameters of each tool. The intuitive LCD interface allows the user to monitor and adjust the bond settings, as well as to troubleshoot in case of any errors or malfunctions. Overall, ASM AB530 is an innovative and reliable bonder, which can be customized to meet the specific needs of each individual user. With its ability to swiftly move between bonding tools and its programmable logic controller for repeatable, high-quality results, AB 530 is an ideal solution for medium-sized device assembly applications.