Used ASM AB 559-IL08 #9288764 for sale

ASM AB 559-IL08 is an automated wire bonder designed for microelectronics packaging. It is capable of handling a wide range of bond sizes, materials, and configurations. This bonder features an easy-to-use touchscreen interface and adjustable parameters that allow for enhanced process control and repeatability. AB 559-IL08 is equipped with a fully integrated servo motor equipment and digital feedback sensors to provide accurate and precise motion control. The bonder has a standard 75Watt stitch-bonding mode and a selectable 150Watt stitch-bonding mode for higher-density applications. It can handle a wide range of materials including gold, copper, aluminum, and steel. The bonder is also equipped with a vision system that allows for positioning accuracy and fast bonding times. The vision unit features an integrated Illuminated machine, object detection, and adjustable lighting intensities. The vision tool scans, identifies, and measures bond parameters with precision accuracy. ASM AB 559-IL08 features a high cycle rate with speeds of up to 350 bonds per minute in best-case scenarios and up tp 200,000 bonds per hour in some applications. The bonder is designed for excellent process yield, low cycle time, and low running costs. AB 559-IL08 is designed to meet the needs of high-volume wire bonding applications, like the automotive industry. The bonder is user-friendly and easily integrated into existing production processes. It is also designed to be upgradable and features an intuitive and reliable software interface. ASM AB 559-IL08 is a reliable and advanced automated wire bonder that is ideal for microelectronics packaging. It features high cycle rates, precise motion control, and an integrated vision asset. This bonder is designed for superior performance, accuracy, and repeatability in high-volume wire bonding applications.