Used ASM AB 559-IL08 #9288779 for sale

ASM AB 559-IL08 is a high quality precision automated flip chip bonder designed to improve the accuracy and speed of high-volume assembly processes, including flip chip and bumped components. This compact machine is equipped with an integrated die-to-die alignment equipment and a comprehensive range of high-end bonding and inspection options to help maximize accuracy and operator productivity. With a single lift-off lid and quick tool-change system, the unit features a highly intuitive graphical user interface (GUI) and multiple integrated vacuum sources. AB 559-IL08 is built with a single work head platform, offering best-in-class placement accuracy and repeatability. The machine accommodates die sizes up to 100um, with a maximum processable die height of 50mm and maximum shoot height of 200mm. An integrated image/optic sensor unit provides superior vision control for accurate placement of components. The bonder utilizes a precision pre-alignment tool that leverages high-accuracy laser sensors and well-defined mechanical repeatability to achieve repeatability of ±5µm. The bonder is designed to generate a uniform thermal distribution and high-pressure contact force, optimizing process yields and enabling high-speed, high-precision drop-in placement of flip chip devices. Its advanced motor control technology ensures a higher level of accuracy and repeatability than conventional stepper-motor driven systems while maintaining consistent performance. ASM AB 559-IL08 also features integrated automated inspection capabilities, with high-resolution CCD camera and on-the-fly x,y die alignment inaccuracy detection. This helps to increase yields by identifying errors prior to any down-stream processing and easily allows for manual re-work or adjustments. Its comprehensive range of available bonds and die-attach materials further helps streamline production, with common bond types including eutectic, conductive adhesive, and K-tivity. Highly reliable and easy to maintain, AB 559-IL08 consists of high-quality components and a closed-loop feedback asset that facilitates the monitoring and control of model performance. This ensures that the bonder remains at optimal specifications, and equips operators with the advanced process control and monitoring tools they need to maintain high yield results.