Used ASM AB 559 #9069894 for sale

ASM AB 559 is a high-performance hotplate bonder specifically designed for automated assembly, encapsulation and hermetic sealing of various optoelectronic components, including arrays, PAN packages, hybrids, and other molded devices. This bonder is also suitable for the production of thermistors, disk drive heads, and other complex electronic components. ASM AB559 features a large area heating and cooling plate that is highly efficient and helps minimize cycle times. The hotplate can reach temperatures of up to 472 degrees Fahrenheit. The plate also has a 0.008 Inchstainless steel surface, providing a uniform temperature distribution across the entire area. ASM bonder employs a high-speed, linear step motor-driven displacing equipment to precisely locate the components in order to bond them together. This linear system is also equipped with a rotary table to accurately place the components in the desired positions. ASM bonder also features user-friendly software with intuitive GUI Intelligent Workflow Unit, or IWS. This machine allows users to edit, manage, monitor, and respond to every aspect of the bonding process from selecting the correct bond type to setting the temperature and pressure. AB 559 also comes with a temperature control tool, which incorporates both fast reliable infrared temperature measurement and precise linear thermal control. Through this asset, the bonder is able to soften the plastic and minimize its warping through a precise thermal profile. This is done by continuing to regulate the temperature after the thermal gradient, rather than a simple turn off. AB559 is designed to be safe, reliable, and robust. Its components have achieved UL, CE, and TUV certificates for safety. The bonder also includes a fanless design and vibration isolation to ensure it operates optimally in any environment. Overall, ASM AB 559 is an advanced, high-performance bonder designed to facilitate high-volume, automated production of a wide range of optoelectronic components and electronic components. The advanced CCD camera and software model, as well as its precise thermal control equipment, allows the bonder to have a superior alignment accuracy during the assembly process. ASM bonder provides a robust and safe bonding process, while ensuring quality, efficiency and safety.