Used ASM AB 559A-06 #293681751 for sale

ASM AB 559A-06 is a bonder designed to perform high-speed bonding of semiconductor devices to substrates. The bonder is a pneumatically controlled system complete with an integrated welding station, heat head, automated workstations, and a reference module for load and test measurements. The bonder includes a heated chamber and a pneumatic shuttle that moves semi-conductor devices between the integrated welding station and the heat head. ASM AB 559 A 06 is designed to perform high-volume production of small components with high repeatability and accuracy. It is ideal for large-scale production of packaged semiconductor devices in the field of microelectronics. The integrated welding station can handle any device size up to 10mm long and performs controlled heating and welding of the components. The automated workstation provides an automated placement of devices onto a substrate or a carrier board for further processing. The heat head features an adjustable temperature range from 100°C to 350°C and contains multiple heating elements to evenly heat the welded joint. The temperature is precisely controlled with a thermocouple that is calibrated prior to starting the process. The reference module is designed to measure the forces of the welding tools and the temperature of the heat head. This helps to ensure the accuracy of the bonder and helps to prevent any thermal dissipation. AB 559A-06 is designed to enable high speed and high quantity production of automotive microelectronics, computer circuits, and MEMS devices. It is equipped with an onboard diagnostic system which allows for full monitoring of the process. Additionally, the user friendly interface ensures clear and concise visual feedback for operating and programming the process. The overall system features greater flexibility and provides improved process control for any flow or process pattern.