Used ASM AB 559A-06 #293743866 for sale

ASM AB 559A-06 is a high-performance, microprocessor-controlled wire bonder designed for the multi-point bonding of large scale integrated circuit chips. The device offers a range of features and capability that make it suitable for a variety of microelectronic chip assembly applications. ASM AB 559 A 06 features a precision pitch and yaw mechanism for accurate placement and tensioning of bonding tool tips. It also includes dual-head ultrasonic, thermal compression, and wedge welding systems to provide a full range of bonding capabilities. The machine also features a 13.6" full color touch screen with advanced diagnostic, alphanumeric, and graphical tools for improved performance and convenience. AB 559A-06 offers a compact design with a fully enclosed, dust-free base that helps to keep the environment clean. Its 0.1-2.0mm wire size capability, adjustable bond length, and 5,000 bond parameters makes it suitable for many types of chip assembly operations. In addition, the device also has a range of productivity features including customizable menus and automatic wire guiding for easy setup and operation. Additional features of AB 559 A 06 include user-friendly real-time databases, advanced security features, and enhanced system monitoring capabilities. It is also designed with an ergonomic control panel and a user-friendly touchscreen interface for improved operation and convenience. The built-in diagnostic system allows users to quickly identify and address any problems. ASM AB 559A-06 bonder is highly reliable and a great choice for any type of microelectronic chip assembly. It offers a wide range of features and performance capabilities that make it suitable for a variety of production scenarios. It is a powerful and precise system that can provide accurate and repeatable results on a production basis, allowing for increased throughput and efficiency.