Used ASM AB 559A-06 #9245034 for sale

Manufacturer
ASM
Model
AB 559A-06
ID: 9245034
Vintage: 2011
Wedge bonder Rotary bondhead Manual loading / Unloading handling Workholder: 4" x 8" Diameter aluminium: 20.8-50.8 µm Diameter gold: 25.4-50.8 µm 2011 vintage.
ASM Model ASM AB 559A-06 is a semi-automatic, tabletop vacuum de-bonder designed for high-precision debonding of SMD components (surface-mount devices) and other chip-level components. It is ideal for medium- to high-volume production applications and can easily be integrated into automated lines. The basic conception of bonding consists in attaching two materials and holding them together by introducing a processable adhesive. The two materials may be two metals, two plastics or metal/plastic combinations. ASM Model ASM AB 559 A 06 is designed to handle all of these materials, providing precise and reliable debonding. ASM Model AB 559A-06 Vacuum De-Bonder consists of an integrated vacuum chamber and head assembly that provide precise debonding control and precise placement of the SMD components. The vacuum chamber is equipped with digital controls which allow the user to control the pressure, time and vacuum settings. The vacuum chamber head is adjustable in both angle and position, allowing for easy and accurate adjustability of the debonding process. The debond process is initiated by positioning the SMD component or chip on the vacuum head, and then activating the vacuum chamber. The vacuum chamber draws the pressure as per the settings, and the SMD component is then slowly released from the surface. The vacuum chamber revents re-bonding to the original surface. ASM Model AB 559 A 06 Vacuum De-Bonder is designed for ease of use and maintenance. All components are designed for fast and easy access for preventive maintenance and periodic parts replacement. The unit is CE certified and meets applicable safety standards. In summary, ASM Model ASM AB 559A-06 Vacuum De-Bonder is an ideal choice for both medium- and high-volume production applications. It features a vacuum chamber and head assembly which provides precise debonding control and placement of SMD components, as well as digital controls which make it easy to adjust the pressure, time and vacuum settings. The unit is CE certified and designed for simple maintenance and trouble-free operation.
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