Used ASM AB 559A-06 #9389646 for sale

Manufacturer
ASM
Model
AB 559A-06
ID: 9389646
Al Wedge bonder.
ASM AB 559A-06 is a specialized bonder for applications requiring a highly reliable connection between substrates and solder-alloy. It allows for precision soldering of metals and other materials such as plastics and glass with the help of an advanced microcontroller, enabling a secure and heat-resistance bond. The device is constructed in a lightweight and compact design, which is ideal for confined spaces. It has two bond heads that are designed to connote the area to be soldered with the help of adjustable and interchangeable jaws. The interchangeable jaws can be tailored to suit the specific requirements of the application. It also has an integrated self-atmosphere control system that helps to maintain the optimal soldering environment by removing any by-products during the soldering process. ASM AB 559 A 06 bonder features adjustable pulse-control parameters, allowing for precise heat output. This offers reliable operation in the field and helps avoid any overheating and unwanted damage to the component or material. The device also comes with an automated temperature detection that optimizes the power output for each of the jaw's purpose, ensuring an accurate and continuous bond. AB 559A-06 is suitable for a wide range of applications, including the fabrication of electronic modules, connectors, power supply electronics and other industrial products. The device has a temperature range of up to 599 °C (3000°F) and can be integrated into automated processes and manual operation. The bonder also features dynamic monitoring and auto-adjustment for parameters which helps to maintain stable operation and reduce calibration time. It is compatible with all industrial standards, including the J-STD-001F standard. AB 559 A 06 also has a self-diagnosis system that allows for the detection of hardware and software problems. Overall, ASM AB 559A-06 is a reliable and powerful bonder designed to deliver a secure and heat-resistant bond in a wide range of applications. It is suitable for both automatic and manual soldering processes, allowing for optimal operating precision and reduced calibration time.
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