Used ASM AB 559A-IL08 #9389643 for sale

ASM AB 559A-IL08 is a microelectronics bonder designed for ultrasonic, thermosonic and thermosonic-regenerative gold/aluminum wedge bonding applications. The bonder uses a standard pulse-on-demand design with an ergonomic footswitch for precise operation. The bonder is equipped with a high-precision wedge-shaped bonding head mounted on a micropositioning three-dimensional stage, which enables accurate manipulation of the bonding parameters. The unit is PC-controllable and includes an intuitive graphic user interface for controlling the bonder parameters. The bonder incorporates the latest advances in bonding technology, including a compressed air system that ensures stable pressure and improved vibration damping. The high-efficiency transducers provide high amplitude for improved weld quality. The thermal control system is precise and provides accurate temperature control for thermosonic-regenerative processes. The unit also includes a protective cover for the bonding head, keeping debris away from the components during the bonding process. AB 559A-IL08 features a wide range of programmable automatic systems for maximized throughput and increased bondal reliability. The bonder is ideal for applications requiring simultaneous high-speed bonding of multiple components, as well as for applications with tight control of the bond parameters. Additional features include fall-back monitoring to ensure process stability, automatic resetting of settings based on the type of material being bonded, and a memory function for fast setup of repeat jobs. ASM AB 559A-IL08 is versatile and easy to use, making it a great choice for automating microelectronic assembly processes. It offers superior bond control, increased throughput, and improved bondal reliability, making it ideal for high-volume production of printed circuit boards, displays, and other components that require precise bonding.