Used ASM AB 559A-IL08 #9389648 for sale

ASM AB 559A-IL08 is a high-performance die attach bonder used to assemble semiconductor components. This bonder is used for high-reliability die attach and has a high throughput rate. It is capable of handling parts up to a size of 82 x 82 mm and has a temperature range of 25 to 350 degrees Celsius. The bonder is designed to provide consistent and accurate bonding of semiconductor components. AB 559A-IL08 has a high-speed Z-axis motion equipment, with a motion speed of 500mm/sec that can be driven with a servomotor or a stepping motor. Its vertical and horizontal accuracies are at the micron level, ensuring that the die attachment process is precise and accurate. The bonder has three processes modes: hot gas, thermosonic, and thermocompression, enabling the user to select from a range of suitable processes. The bond head, equipped with vacuum-driven die sticking and a multi-handed handling system, allows for fast and reliable die attach processing. The bonder also features a vision unit for for automated die placement accuracy. With this machine, alignment of the dies to the substrate is completed in less than a few seconds. This enables the ability to handle the components in a cost-effective manner. The bond head motor features a fast, reliable Z-axis servomotor with feedback circuitry, providing accurate placement of parts. The tool is equipped with a User-Friendly touchscreen display, allowing the user to easily access the various functions of the bonder. The parameters can be quickly set up and altered while allowing users to adjust the bonder. Additionally, the asset has built-in data logging and data storage functions, enabling users to store and process large volumes of information. In conclusion, ASM AB 559A-IL08 is a high-performance die attach bonder that is designed to provide consistent and accurate bonding of semiconductor components. This bonder is equipped with advanced features such as a multi-handed handling model, a vision equipment, and feedback circuitry. It also has a user-friendly touchscreen and data storage functions as well. All in all, AB 559A-IL08 is an ideal choice for high-reliability die attach processing.