Used ASM AB 559A-IL08 #9389650 for sale

Manufacturer
ASM
Model
AB 559A-IL08
ID: 9389650
Al Wire bonder.
ASM AB 559A-IL08 Bonder is an advanced machine for die bonding and die attach applications. It is equipped with a high precision active alignment equipment for moderately complex, fine feature die attach applications. AB 559A-IL08 uses advanced thermal, vision, and tool technologies to precisely and reliably place and attach die to substrates. The active alignment system is designed to reduce misalignment and increase placement accuracy. The active alignment optics, combined with advanced vision, provide extremely high precision die placement accuracy. ASM AB 559A-IL08 offers fully automated heat application, dispensing, and die attach capabilities. It is equipped with a precision single-point, carbide die bonder which has a programmable Z-axis movement for precise control of bond force. Its high precision vision unit also provides repeatable accuracy and reliable placement results. The integrated Heating Block™ maximizes thermal uniformity and reliability for long-term die placement and die attach performance. AB 559A-IL08 is equipped with a multiple hot bar based heated stage for reliable, repeatable pre-heating applications. Additionally, it can accommodate two cassette sizes (0.4"x1" and 0.4"x2") for die attachment down to 40µm pitch. It also offers an optional Hot Ink Applicator Machine for accurate hot ink fiducial marks and solder paste printing. ASM AB 559A-IL08 delivers superior throughput performance with its advanced robotic material handling and placement tool. It is designed to be fully upgradeable with more advanced technology if necessary. AB 559A-IL08 is a fully automated stand-alone machine that provides reliable, repeatable performance for fine feature die attach applications. Its advanced thermal, vision, and tool technologies ensure precise and reliable die placement and placement accuracy. With its highly accurate active alignment optics and precision die bonding tool, it enables reliable attachment of die down to 40µm pitch in a variety of applications. Additionally, ASM AB 559A-IL08 incorporates an optional Hot Ink Applicator asset for accurate hot ink fiducial marks and solder paste printing.
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