Used ASM AB 559A-IL08 #9389653 for sale

ASM AB 559A-IL08 is a fully automated, multi-axis, closed-loop bonder designed for the production of conventional and customized microelectronic assemblies. This advanced equipment delivers precision placement of devices and components with maximum 5-axis motion and repeatable accuracy. The bonder utilizes an onboard vision system and can accurately identify device and component types, as well as locate device placement points on the substrate or board. The device selection can be manually programmed for any assembly, allowing it to be compatible with processes such as die attach, wire bond, pre-form, and flip chip. The X-Y motion of the bonder is controlled through a high-speed, fully digital servo drive, while the Z axis is programmable and has a built-in tool leveling unit. AB 559A-IL08 also features an integrated automated optical inspection (AOI) machine that is designed to detect defects such as incorrect or missing components, misalignment of pads, and incorrect wire bonds. The tool has six different illumination sources and two manual zoom control knobs that allow the user to adjust the field of view on-the-fly or match the motion of the bond head. In addition to the AOI asset, ASM AB 559A-IL08 includes the ability to independently control the temperature of each substrate and the pressure of each bond head, as well as a full suite of diagnostic tools for troubleshooting. AB 559A-IL08 is a powerful and capable bonder with features that make it an ideal choice for any microelectronic production line. Its ergonomic design and high degree of automation make the process of assembling boards and devices simpler and more efficient than ever before, helping to ensure an end-product of the utmost quality and reliability.