Used ASM AB 559A-IL08 #9389654 for sale

ASM AB 559A-IL08 is a fully automatic semiconductor bonder. It is designed for optimal reliability and average throughput for a wide range of wire bonding applications. This bonder features an innovative single belt-style feeder equipment that minimizes downtime and ensures precise, repeatable ball-loop formation. Its high-speed micro-positioners provide precise wire control while minimizing stiction. Its light force loop closure steps make reliable wire loops of a variety of sizes, shapes, and configurations, with ball-loop heights easily monitored and quickly adjusted. This AB 559A-IL08 also features user-friendly and intuitive programming with a color touch-screen interface for easy navigation. This intuitive programming allows operators to quickly learn to program, change, and reset parameters. The bonder also has a self-diagnostics system that includes built-in temperature and process validation alarms for quick recovery and shortened troubleshooting time. Its integrated automatic wire trimming module ensures accurate wire trimming, helping to reduce scrap. Additionally, its low-pressure, high-resolution vision unit helps to ensure precise wire placement and looping. This ASM AB 559A-IL08 bonder can be equipped with up to five axial-bonding heads for bonding small-pitch, high-precision applications. Its modular design can be continuously expanded to meet high-volume manufacturing requirements. The bonder is also equipped with an automatic place-and-bond feature that enables multiple parallel processes without input from the operator. AB 559A-IL08 is capable of wireless operation, able to store up to 99 programs, and offers built-in alphanumeric data-tracking capabilities for easy traceability and record-keeping. Its ergonomic design has been optimized to reduce operator fatigue and improve operator safety. Its modular design and steel chassis provides superior vibration reduction resulting in increased uptime. ASM bonder also utilizes an advanced cooling machine that dissipates heat build-up to ensure consistent performance. Its durable metal frame is designed to withstand years of continuous use in a harsh manufacturing environment. ASM AB 559A-IL08 is a reliable and cost-effective semiautomatic wire bonder for a variety of wire-bonding applications. Its modular design is easily expandable to meet high-volume production requirements. Its intuitive programming capabilities and user-friendly interface make it a breeze to use, even for inexperienced operators. Its high-speed micro-positioners provide precise and repeatable ball-loop formation, while its light force loop closure steps ensure reliable wire loops. Its powerful cooling tool ensures consistent performance, and its durable metal frame can withstand years of continuous wear and tear.