Used ASM AB 559A #293649812 for sale

ASM AB 559A is an automated laser Ultrasonic bonder designed for bonding small to mid-sized assemblies in the field of microelectronics. The equipment is capable of providing high precision bonds and reliable performance with accuracy up to 5um at 45°. It has a high-performance turn-key solution that is designed for a wide variety of bonder applications, ensuring a reliable and consistent result with high accuracy. ASM AB559A bonder uses a laser ultrasonic technique to bond small parts. It features a compact, highly integrated system with a solid state laser source and a 3D galvo scanner for precise and repeatable alignment of the bond. The unit has a high-resolution vision machine that allows for precise positioning and operating conditions such as laser power and pulse duration optimization. AB 559A is equipped with a range of advanced features such as a multi-point scanning capability, adjustable scanner position, a built-in solder pot, variable fitting tool, and adjustable tip position. As a result, great bonding results can be achieved, even for non-standard sized parts. In addition, the asset is designed to reduce operator fatigue with automatic programming and flexible procedures, while providing a large library of available applications. AB559A has a host of additional features that enhance the overall performance of the model. There is an integrated UV-LED source for post-process inspection, along with an external material database that allows for automatic selection of common base materials. This ensures that the right laser parameters and characteristics are used for each role. The bonder also has safety features designed to protect the user with an emergency stop button, eye protection, E-Stop, and an audible alarm. ASM AB 559A is an up-to-date, easy to use laser bonder equipment that provides reliable results and a wide range of applications. With its flexible programming and adjustable components, the system is ideal for a variety of microelectronic bonding applications, allowing for precise and accurate bonds. The advanced features make the unit a highly cost-effective and reliable production solution for industries requiring high-level bonding technology.