Used ASM AB 559A #9119595 for sale

ASM AB 559A is a bonder designed for the reliable connection of a variety of semiconductor materials and components. It is an advanced, fully automated, three-head attachment equipment that is ideal for fast and cost-effective bonding in high-volume production environments. ASM 559A offers top-of-the-line performance for precision bonding applications. It features a high-resolution camera that can distinguish 0.025 mm (0.001 in.) difference in structures, an X-Y working range of 300mm (11.81 in.), and an accuracy of 0.02 mm (0.0008 in.). The camera gives operators reliable positioning for each bond, and at the same time allows for a maximum bonding speed of over 12000 bonds per hour. The fast cycle time and reliability of ASM 559A are made possible by its advanced technology. It utilizes an ultra-sensitive capacitive sensing system that can detect and identify the exact bonding position instantaneously. This unit helps ensure that bond points won't be missed, and that no misalignment will occur on the target bond surface. The bonder is also equipped with a Fusion Bonding machine that is capable of connecting dissimilar materials, like silicon, gallium arsenide, indium phosphide, sapphire, and titanium. This Fusion tool is even capable of bonding materials with different properties, such as dielectrics, metals, and ceramics. ASM 559A is built to withstand the harsh conditions of a production environment. Its body is constructed of a high-quality aluminum alloy that is resistant to corrosion, and is designed for stability and shock resistance. Additionally, the device is equipped with an advanced cooling asset that provides optimal heat management and eliminates the need for external cooling. ASM AB559A is an advanced, high-performance bonder for large-scale production. With its advanced technology, reliable performance, and durable design, it is the perfect choice for any production line requiring precision bonding of semiconductor materials.