Used ASM AB 559A #9251720 for sale

ASM AB 559A is a high performance hot-bar bonder designed specifically for bonding wires, ribbons, and die-attach to a wide range of substrates including BGA, QFP, MLF, SOIC, and ChIP. ASM AB559A contains a combination of robust and precise physical and thermal design features to ensure Quality Bonding performance and repeatability. The thermopulser mechanism of the hot-bar bonder allows for the precise thermal control and rapid temperature changes required for a successful bond. The heat and pressure for bonding is produced by two-axis proportional control motors, along with a PID algorithm for precise thermal control. AB 559A is also equipped with a precise force control function and load sensors to monitor bond force. An integrated vision system allows for the identification and verification of the part to be bonded, as well as providing feedback on the bonding quality once the bond is complete. The bonder is also provided with an intuitive software that enables the user to program and monitor various parameters associated with the bonding process. The process is initiated by a drawing data that is loaded into the integrated software and the process cycle is automated by the auto-bond instruction from the operator. During the process cycle, the hot-bar first moves to secure the component more tightly into the chuck in order to securely contact the substrate. Next, a defined temperature is applied to the hot-bar, and then applied pressure is achieved by motion of the x and y axial z-stage. Once bonding is complete, the integrated vision system can inspect and verify the bond quality, as well as provide a confirmatory signal for the operator. The bonding cycle is then completed and the operator may start the next bonding cycle. AB559A hot-bar bonder is suitable for volume production, as it is capable of high throughput and repeatable reliability.