Used ASM AB 559A #9277577 for sale

ASM AB 559A is a fully automated wire bonder designed for high production of wire bonds on dies and packages. The machine is suitable for a range of different bond types, including ball and wedge gold bonds, and gold-to-gold stud bonds. The machine utilizes a semi-automatic algorithm which monitors the wire feed speed and bond characteristics to ensure high accuracy and consistent bond quality. This algorithm also functions independently of the operator, so it can be left to run unattended and improve efficiency. The machine offers a wide range of process parameters which can be adjusted to suit different types of module and wire sizes. ASM AB559A features a load port which can accommodate up to six die packages at one time. This allows for a quick and efficient transition between packages when needed. The graphical user interface of the machine is intuitive to use and includes multiple language options for easy communication. The main components of AB 559A consist of a control unit, a programmable motion control unit (PMCU), an electrical cabinet, a bond head, a wire pull unit, and a vision camera. The control unit provides the machine with high-speed signal processing to analyze data and quickly adjust process parameters. The PMCU is responsible for monitoring and controlling the movements of the machine as it carries out the wire bonding process. The electrical cabinet provides power and control signals to the bond head, wire pull unit, and vision camera. The bond heads are where the precision wire bonds occur and feature an advanced pneumatic system for precise control of the force applied to the bond. The wire pull unit allows for the wire to be pulled back accurately. Lastly, the vision camera provides information about the position and size of the bond to the control unit. AB559A is an ideal machine for ensuring accurate and consistent wire bonding with a high throughput. It features the latest in state-of-the-art wire bonding technology and is suitable for a variety of applications. Its customizable parameters and semi-automatic algorithm are designed to maximize efficiency and provide high-quality bond runs.