Used ASM AB 559A #9277604 for sale

ASM AB 559A is a multi-function automated wire/cable bonder that is designed for microelectronic/semiconductor device assemblies, and it can be used to perform a variety of different bonding processes including wedge, stitch, ball, thermosonic, and bump bonding. The machine features a stationary work station that houses the bond head, a digital control panel, and a built-in vision equipment for monitoring the bonding process. It also features an automatic wire wrap system, allowing for the automated and accurate innerlayer wrapping of wire on wireboards. ASM AB559A is equipped with a special diagnostics unit for troubleshooting the bonder and implementing preventive maintenance steps, should they be necessary. The machine's bond head is capable of a large range of motion, which allows it to be used for bonding on a wide variety of different substrates without making additional adjustments. The bond head consists of a set of vertical and horizontal tungsten pins, and the bonds are performed using adjustable voltage, temperature, and time. The power supply is programmable with precise control of the current, and the environmental conditions can be monitored and adjusted as necessary. The digital control panel provides instant access to the bond parameters, allowing the operator to update settings quickly. AB 559A is equipped with a specialized vision machine for automatic inspection and monitoring of the bonding process. The vision tool consists of a multi-camera asset, and its software can detect bond quality and identify defective components. The model can also be used for integrating multiple inspection and test processes, including microscope, metallographic, shear, and pull force testing, into a single machine. The machine's automatic wire wrap equipment allows for the automated and accurate innerlayer wrapping of wire on wireboards, including the bonding of larger substrates. This system is capable of managing the tightest wireboard and wire wrap locations. The operator can adjust the machine's tension, height, and speed settings if necessary. Furthermore, the machine is also capable of pre-programmed wire wrapping inputs, allowing for production-controlled, uniform, and repeatable output results. AB559A is a highly efficient and automated wire/cable bonder with a number of features designed to support precise and versatile bonding operations. This machine is the ideal solution for a wide range of circuit board manufacturing and microelectronic device assembly applications.