Used ASM AB 559A #9364440 for sale

ASM AB 559A Bonder is an advanced production bonding tool used mainly for wire bonding applications in the semiconductor industry. The primary function of the tool is to establish and maintain connections between two or more physical objects. ASM AB559A is an advanced solution for wire bonding that can be used in a variety of different applications. The device is designed with a user-friendly interface that allows for easy operation and access to its various functions. It is equipped with automated features that enable the user to set and control specific parameters relating to the process. It also includes a high-performance light source that provides precision alignment and control of the wire being bonded. AB 559A also has a number of other features such as the ability to change the magnification of the bonder to ensure accurate bond placement and control. AB559A is capable of handling Microbond, Nanobond, and Delta wedge bonds. It is able to precisely control the contact force, temperature, and rate of melting for the wire bonding process. Setup and control instructions guide the user through the entire wire bonding process. The device incorporates advanced technology to produce a high-quality, reliable bond that is also uniform in size and shape. ASM AB 559A boasts an array of safety features as well, including infrared sensors to detect objects that are nearby and a counterbalance system to hold the bonder steady during wire bonding. It is also equipped with a built-in chip that monitors the performance of the bonder and alerts the user of any potential issues. ASM AB559A Bonder is an easy to use device that combines advanced technology and user-friendly features into a user-friendly solution for wire bonding operations. With its superior accuracy in bond placement and the ability to monitor the performance of the bonder, AB 559A offers an efficient and reliable solution for any wire bonding process.