Used ASM AB 559A #9389534 for sale

ASM AB 559A is a fully automated bonder designed for use in the assembly of semiconductor devices. It is a thermocompression wire bonder capable of performing the most common types of bonding techniques such as ultrasonic, wedge, and thermal compression jointing. It is a pre-programmable equipment with up to 10 programmable parameters, allowing for flexibility of use and every production requirement. This system also allows for easy maintenance and component replacement, making it a reliable partner in the semiconductor manufacturing process. ASM AB559A offers a wide range of features and capabilities. The unit comes with a unique multiple program memory, where up to 10 different wire bonding programs can be stored. This allows for quick and easy recall of programs without the need for manual programming. It also provides accurate control for the bond pressure and temperature, so that delicate semiconductor components can easily be bonded to each other without risking damaging them. Its ability to work with a wide range of wire types and sizes makes AB 559A extremely versatile. The machine's software allows for precise and repeatable bond processes with a high repeatability accuracy. This makes it ideal for automated bonding scenarios, where conformance to exact bonding specifications is crucial. To keep up with the pace of the semiconductor industry, AB559A is designed to have a cycle time of just 2 seconds per bonded joint. It is also capable of bonding components of different sizes and shapes, making it suitable for a wide variety of applications. ASM AB 559A is a user-friendly tool that is easy to operate. Its intuitive user interface is designed to be simple and straightforward, so that any user can quickly learn how to operate the asset. The model also features automatic and semi-automatic functions to reduce the amount of human input required. The equipment is supported by a comprehensive suite of diagnostic and service software, making it easy for technicians to keep the system running smoothly. ASM AB559A is a reliable and efficient bonder for assembling semiconductor devices. Its wide range of features and capabilities make it a versatile unit, allowing it to accommodate a variety of bond techniques and components. It is easy to use and maintain, plus its reliable performance ensures that it is a reliable partner for industrial automation.