Used ASM AB 559A #9399701 for sale

Manufacturer
ASM
Model
AB 559A
ID: 9399701
Vintage: 2004
Wedge wire bonder 2004 vintage.
ASM AB 559A is a benchtop bonder designed for the automated microelectronics assembly and manufacturing process. It is designed for use in applications such as discrete component attachment, lead-frame attach, flip chip attach, and other SMT technologies. ASM AB559A is suitable for medium-volume production and prototyping in the microelectronics sector. AB 559A is a fully automated bonder that utilizes a combination of vision and motion control systems to accurately attach microelectronic components on substrates. The equipment can program multiple attach patterns, and is capable of attach rates in excess of 10,000 placements/hour. The bonder is equipped with two heads and four nozzle styles to meet varying application requirements. It supports a wide range of SMT components including SOIC, PLCC, QFP, and BGA. The system can bond on substrates ranging from 100 um to 4 mm in pitch spacing. AB559A also offers an integrated solder material dispenser for precision deposition of gel, paste, paste-reactive, or reballing solder/alloy. An integrated solder scanner provides an automated verification of the attachment process, and is capable of detecting post-solder shorts, opens, coplanarity, and bridging defects. Additionally, the unit features a liquid crystal display (LCD) which provides the operator with machine parameters, process statistics, diagnostics, quick start-up functionality, and if necessary, user-defined editable parameters. For safety, the tool is equipped with built-in protections such as ESD control, fume extraction asset, fire protection, and automatic shutdown in case of emergency. The cabinet is made of durable steel and is designed to meet stringent environmental requirements. Additional security features include a programmable lock model and keypad control. ASM AB 559A is a powerful and reliable automated bonder that is suitable for various SMT applications. It is designed to provide optimal performance and accuracy in microelectronics production and assembly, and is capable of providing reliable results for users in the microelectronics industry.
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