Used ASM AD 880 #9394945 for sale

ASM AD 880 is a bonder by ASM International. It is a solid state automated bonding system. The system is used in tandem with a semi-automated pre-bonder. This high-precision combination enables rapid and efficient attachment of semiconductor devices to carrier substrates. AD 880 couples a flame-spraying technology, a pressure-welding technology and a thermosonic welding process in its integrated solution for wire bonding. Specifically, a fine ruby-tipped flame-spraying flame tip is inserted through a ferrule bearing a sputtering nozzle. The flame tip is then moved in a synchronized manner to create a thin, consistent film. A pressure-welding technology, meanwhile, is employed to attach solid bonds to the film. Finally, thermosonic welding is then used to transfer the bonds between the substrate and the device. This bonder has multiple advantages, with the core benefit being its ability to create high-quality bonds with a high level of accuracy and repeatability. It is also designed for easy setup and minimal maintenance requirements. Its automated process, moreover, helps shorten cycle times, meaning jobs can be completed faster. ASM AD 880 is well-designed for many of the most demanding applications, including wire bonding, die-attach, adhesion and augmentation, as well as intermediate-temperature repair. It works with a range of materials, such as Au, Cu, Al, epoxy and polyimides. It is particularly suited to semiconductor components, which can be bonded in a range of configurations, from flip-chip assemblies to multi-chip modules. AD 880 is ideal for applications in a range of industries, from automotive to medical. It has a long-standing reputation for being a reliable, high-precision bonding system. Its compact design, moreover, makes it ideal for large-scale, turn-key production lines. Overall, ASM AD 880 is a powerful and reliable bonder for creating high-quality connections on a variety of substrates and components. Its advanced technologies enable rapid and accurate attachment of semiconductor devices, streamlining processes and making it a key component of many integrated production lines.