Used ASM Cheetah II #293633714 for sale

ASM Cheetah II is an advanced wafer bonding equipment designed for production of high performance, high reliability microelectronic devices and MEMS. Cheetah II provides unprecedented levels of process control and automation for a variety of different types of wafer bonding, including low temperature wafer bonding, laser thermal compression bonding, and eutectic bonding. ASM Cheetah II features a robust and reliable design, allowing for robust repeatable processing at high-level yields. Cheetah II includes a dedicated bonding chamber, allowing for precise temperature and pressure control. The system also includes a high accuracy positioner, allowing for precise control of alignment and placement of bonded wafers. ASM Cheetah II also features a high-speed wafer dispensing unit which improves throughput and reduces errors in wafer handling. Cheetah II can perform a variety of different wafer bonding processes, including anodic bonding, direct fusion bonding, and eutectic bonding. In anodic bonding, an electrical field is applied to the wafers while they are heated, causing them to bond together. Direct fusion bonding requires the wafers to be heated directly which can create local thermal gradients and force the wafers to bond without a coating. Eutectic bonding is accomplished by first coating the bonder area with a fine film of solder and then melting the solder using a laser. ASM Cheetah II includes several configurable process settings and can be used to tailor the process to specific application requirements. The machine includes a multi-axis stage with rotation, translation, and tilt capabilities, ensuring precise alignment and placement of wafers for a variety of wafer types. Cheetah II also features advanced optical and thermal controls, allowing for precise thermal and optical measurements for maximum process repeatability. ASM Cheetah II is capable of producing bond forces in excess of 1,000 N and offers repeatability in the tens of nano-Newtons. The tool supports 1.5 kW of laser power and is capable of bonding wafers with thicknesses ranging from 200 to 1000μm. Cheetah II also contains a robust software suite, allowing users to program wafer bonding sequences and store process recipes for repeated production runs. ASM Cheetah II is designed for low cost, high yield, and reliable production of microelectronic and MEMS devices. The asset offers repeatable high accuracy wafer bonding, leading to increased yield and quality in the production of microelectronic and MEMS devices.