Used ASM Cheetah II #293634214 for sale

ASM Cheetah II is a thermosonic bonder used for a variety of microelectronics applications. It is a single-axis bonder that employs both thermosonic and ultrasonic bonding techniques. It has a modular design, with its main components being the bondhead - which utilizes a laser guided alignment system; the wafer chuck - which holds the wafers in place during the bonding process; and the oscillator - which heats the bond tip to the necessary bonding temperature. Cheetah II is capable of producing quality bonds with both aluminum and copper wires, ranging in size from 0.25 mils up to 10 mils in diameter. It also features several built-in safety features, such as pressure and temperature sensors, to protect against damage caused by excessive bonding force or temperature. ASM Cheetah II also includes an optional vision system, which allows operators to precisely locate and place components with greater accuracy. The bonder is managed by a Windows-based software, which includes powerful modules like the Bond Optimizer and Recipe Builder. The Bond Optimizer is used to fine tune the calibration of the bonder, enabling users to achieve the highest bond yield available. The Recipe Builder is used to develop, organize and store individual bonding recipes, reducing setup time and providing an easy method to save complex arguments. Cheetah II is designed for 24/7 operation in a cleanroom environment, as well as for use in harsh or extreme surroundings such as in aerospace and automotive manufacturing. Its highly precise applications make it ideal for high-grade electronics, including HDMI connectors and microfluidic devices. ASM Cheetah II bonder provides a reliable and robust bonding solution for a range of industries. With its easy to use and straightforward operation, it is an ideal choice for any application requiring reliable, precision bonding.