Used ASM Cheetah II #293634220 for sale

ASM Cheetah II is an advanced bonder designed for reliable high-speed flip chip and wafer-level packaging. This bonder is capable of extremely precise positioning, making it ideal for a wide range of advanced packaging applications. The advanced features and ability of Cheetah II allow it to provide highly precise placement of components during assembly and packaging. With repeatability of just ±10 microns and resolution of ±1 micron, the bonder offers an unmatched level of precision for the most demanding applications. Furthermore, the bonder incorporates a unique design for both its placement surfaces and the press mechanism, allowing for repeatable bonding and handling of components with minimal disruption of the device under test (DUT). ASM Cheetah II's automated real-time capability allows for changes to settings to be made in a matter of seconds. This allows for quick processing and assembly of components, reducing cycle times and creating a more efficient production process. Additionally, the bonder includes an integrated vision system for accurate in-situ alignment and carousel recognition, providing the detailed inspection and optimization needed for the most demanding and advanced packaging applications. Cheetah II is designed to provide both speed and accuracy. Its up to 1.2 meter per second maximum speed ensures that the components can be moved and placed quickly, and its ability to accurately place components in a range of sizes, shapes, and orientations make it an ideal solution for packaging solutions that require precision. Moreover, the bonder's integrated alignment technology allows for accurate placements with minimal disruption and disturbance of components. ASM Cheetah II also offers a wide range of advanced features such as an optimized part exit system, a vacuum debonder, adjustable nozzle height and force, and multiple optional accessories including integrated vision systems and automated carousels. All of these features combined make the bonder perfect for both comprehensive small and large packaging solutions. Cheetah II is setup for fast, accurate, and dependable small and large package assembly. With its unparalleled precision and reliable speed, the bonder is a valuable asset for any packaging operation seeking to increase throughput and precision.