Used ASM Cheetah II #293634221 for sale

ASM Cheetah II is a hybrid thermal-compression bonder designed to offer superior vibration control and improved imaging capabilities in comparison to conventional electronic wire bonders. It is commonly used in the manufacturing of electronic assemblies, chip packaging, and other high-performance microelectronics applications. Cheetah II utilizes a highly advanced design to accurately control the thermocompression bonding process. Its advanced Hall effect technology provides superior vibration control, enabling precision bond formation with minimal wire movement or vibration. For accurate imaging, the bonder includes a high-resolution CCD camera with a 5X zoom for precise assessment of the bond during setup, monitoring and in-process inspection. In addition to its precise imaging capabilities, ASM Cheetah II also provides precise control over the thermocompression bonding process. It is able to accurately control temperature, bond timing and dwell time, as well as bond force. The precise settings allow for precise bond formation, limiting any chance of damage due to excessive wire movement. Cheetah II is also equipped with a CO2 laser for performing imaging and bond marking tasks. The laser is programmable to provide precise marking and scribing capabilities, enabling accurate imaging of wire bonds for verification of bond integrity. To ensure long-term performance and reliable bonding, ASM Cheetah II includes an advanced wire feeder module. The module features a unique EMans™ feed design for automated, in-place wire feed and accurate placement. The feeder also provides precise wire tension control, ensuring that the wire is delivered at consistent tension from the bond head to the bond pad. Overall, Cheetah II is an advanced, highly precise bonder designed to meet the needs of users in the precision bond manufacturing industry. Its vibration control and precise control over the bonding process offer the assurance of reliable and robust bond quality, while its imaging and scribing capabilities provide the accuracy necessary for ensuring bond integrity.