Used ASM Cheetah II #293634225 for sale

Manufacturer
ASM
Model
Cheetah II
ID: 293634225
Vintage: 2017
Wire bonder 2017 vintage.
ASM Cheetah II is a fully automated die bonding platform that is designed to provide high quality, reliable die placement and attachment. This bonder is ideal for customers looking for an industrial production equipment that maximizes reliability and minimizes time to market. The bonder has a simple, easy-to-use design that facilitates quick setup and operation. Cheetah II has a high-precision 4-axis stage with high repeatability and up to 1 μm resolution. This stage ensures consistent package-to-die alignment and placement accuracy. The bonder also features a high accuracy vision system for die placement verification, part rotation, and fiducial alignment. The platform's indexer offers up to 16 levels of loadable recipes with up to 48 locations for die placement. ASM Cheetah II is equipped with multiple bonding options for die attach, wedge bond, stitch bond, and flip-chip application. Die attach is performed using a heated wedge device on the die which creates a mechanical interlock between the die and the substrate. Wedge bond is done by using a wedge wire connection technique to create an electrical connection between the die and the substrate. Stitch bond is done using a solder-filled wire to mechanically and electrically connect the die to the substrate. Flip-chip is an advanced bonding method where die are flipped and aligned with electrodes on a substrate to create an electrical connection. The bonder is controlled via an easy-to-use, touch panel interface and offers a wide range of support options. Cheetah II also supports multiple lot management and traceability features such as "no-lot" processing, multiple lot tracking, and screen-based operator communications. This creates an efficient and robust production unit that is ideal for a wide range of die attach applications. ASM Cheetah II is a cost-effective production machine that delivers high accuracy, reliability, and repeatability. The well-designed platform, reliable bonding techniques, and comprehensive management functions makes this a great option for production or research and development applications.
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