Used ASM Cheetah II #293634226 for sale

Manufacturer
ASM
Model
Cheetah II
ID: 293634226
Vintage: 2017
Wire bonder 2017 vintage.
ASM Cheetah II is a vacuum die bonder designed to efficiently and accurately attach die, PC boards, and other components to a given substrate. This product utilizes advanced software, state-of-the-art machine vision systems, and a precision motor for the best in accuracy and throughput. The Cheetah's compact size and its ability to bond metal, plastic, ceramic, and flexible substrates make it perfect for a wide variety of die bonding applications. Cheetah II utilizes a two-axis equipment for accurate and repeatable bond placement. It has a single pick-up location for placing die and components. The Cheetah's software-controlled motor and precision vision system enable it to accurately identify and place each die and component according to predetermined parameters. ASM Cheetah II has three user-defined bonding programs, so users can program the bonder to perform specific jobs with ease. Cheetah II is capable of consistently producing die bonds of the highest possible quality. It features an innovative, automated vision unit and a high-precision motor to ensure tight bond tolerances and reliable performance. The Cheetah also features intuitive controls and a highly programmable software package. This allows users to customize bond settings such as bond pressure and power and select the most appropriate bonding processes based on the application. ASM Cheetah II is also equipped with a variety of support components, such as a power supply, electronic sensors, and an integrated vacuum generator. These components provide the necessary power to run the machine and help to ensure reliable and repeatable performance. Additionally, Cheetah II is outfitted with an electro-pneumatic feeder, making it easy to replace damaged or worn components. Overall, ASM Cheetah II is designed to deliver superior quality and reliability for die bonding operations. Its ultra-precise dual axis tool, intuitive controls and user-friendly software, and a versatile configuration make it a great choice for both laboratory and industrial die bond applications.
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