Used ASM Eagle 10 #9261665 for sale

ASM Eagle 10 is a high-precision, automated wire-bonder designed for use in the semiconductor packaging industry. This automated machine is capable of bonding bare dies and other semiconductor packages to Printed Circuit Boards (PCB). It has a high-speed electric motor and an advanced controller to ensure quick and accurate bonding operations. ASM EAGLE-10 has an adjustable bonder head that allows for various bond lengths and application requirements. The machine can be programmed for different bonding methods such as ball-wedge and thermo-compression. In addition to its high precision, Eagle 10 also offers a suite of advanced features to ensure repeatable and reliable bonding results. This includes an intuitive graphical user interface (GUI) and a host of process control technologies. These process control technologies include two-way communication, barcode scanning, real-time feedback and performance monitoring. All these features help minimize unnecessary setup and calibration time to reduce operator overhead. EAGLE-10 also comes with a number of optional features such as laser-guided pointing and z-direction alignment, as well as support for non-standard automation processes. ASM Eagle 10 also comes with a suite of built-in safety features. This includes an anti-static platform, safety interlock bars, recessed treadmill tracks and detachable safety grids. Expanded safety features such as vision inspection and motion sensors are also available. ASM EAGLE-10 is capable of high-speed, high-precision bonding processes. It is a perfect fit for many automated semiconductor packaging applications including those from mobile device and automotive electronics industries. Its compact design, advanced process control and automation technologies, and robust safety features ensure efficient, reliable and repeatable bonding processes.