Used ASM Eagle 10 #9293649 for sale

ASM Eagle 10 is a fully automated bonder, designed to offer high quality, high precision and repeatable thermocompression bonding. The equipment is designed to provide consistent and reliable performance for a wide range of applications from flip chip to wire bond processing. The system features a choice of integrated vision systems and an integrated aligner with real-time feedback. The bond head has a high inertia, and the servo motor drives are able to achieve acceleration rates up to 5G on all three axes. The unit also features a very low weight of 1.4 kg, which is designed to reduce thermal deformation, and is driven by a standard high torque stepper motor. The integrated vision systems are designed to identify and locate individual chips within a wafer, as well as any defects such as foreign particles, open connections and broken interconnects. The vision machine is capable of reading bar-codes, and the tool can tailor a specific program for each product. The asset also features a desktop unloader, designed to enable individual die placement, or up to 8 full die strips efficiently, with precise accuracy. The X-Y-Z axis stroke can be adjusted from 0.8 to 59.5mm with optional extended lengths of up to 149.5mm. Additionally, this model features a high speed loading arm and die carrier for ease of use and repeatability. The equipment features three different bond heads, designed to maximize repeatability and accuracy and offer stability at high temperature. Furthermore, the bond head can be equipped with an AC supply, allowing the operator to either trigger a new wire or perform thermocompression platinum bump bonding. In addition, ASM EAGLE-10's bond head features a high speed wire tensioning system, allowing for faster processing cycles and lower long-term maintenance costs. Finally, the unit is compatible with the Bond Manager program allowing users to adjust bond cycle parameters in seconds. Eagle 10 machine is designed to be the ideal solution for any industry requiring thermocompression/nano-bonders, with its high accuracy and reliability and repeatable performance, making it an ideal choice for any production company or laboratory.