Used ASM EAGLE 12 #9293651 for sale
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ID: 9293651
Wafer Size: 12"
Vintage: 2010
CVD System, 12"
Process: Curing
2010 vintage.
ASM EAGLE 12 is a state-of-the-art automated bonder designed to manufacture advanced devices. It is a versatile platform that can be used to create a wide range of electronics and devices requiring interconnections and bonding solutions. The smart design of the platform enables the user to quickly and accurately create devices tailored to their needs. The device features a three-step bonding process which includes pre-alignment, fluxing, and direct bonding. The pre-alignment process flashes a light beam on the parts to be bonded and automatically aligns them for the most accurate connection. The fluxing step is used to clean the surfaces of contaminants for optimal bonding and the direct bond collection seals the joints together, forming a reliable, secure connection. ASM EAGLE-12 utilizes a sophisticated vision system for accurate recognition of geometry of the parts and to assist in the alignment process. This technology provides fine line accuracy for solder joints and offers an efficient alternative to manual assembly processes. The device is also instrumented with a thermal process controller to ensure a safe and timely bond. EAGLE 12 is capable of handling a variety of components including but not limited to bare and plated thermals, connectors, relays, switches, sockets, and wires. Its design consists of three main modules - workstage, drive module, and optical module - to provide a high-speed, and controlled bonding process. All of these features make EAGLE-12 a powerful and necessary device for the electronic manufacturing industry. ASM EAGLE 12 is built with the operator in mind, featuring a bright touchscreen display with intuitive navigation and controls, and automatic part recognition. Modularity options are available to allow for greater operator flexibility as well as machine diagnostics to maintain optimal performance. With its precision and streamlined design, ASM EAGLE-12 is a powerful, reliable bonder perfect for producing state-of-the-art devices.
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