Used ASM Eagle 60 Standard #91927 for sale

ASM Eagle 60 Standard is a specialized bonding equipment that simplifies and offers precise control over the entire bonding process. This system is commonly used in the precision assembly of leading-edge electronic devices such as cell phones, cameras and smart home automation devices. Eagle 60 Standard features intuitive and easy-to-use software and touch-screen control fully integrated with the state-of-the-art thermally controlled bonding chamber. This comprehensive bonding unit provides both manual and automated operation. ASM Eagle 60 Standard offers an advanced and efficient method for soldering, bonding and encapsulating devices. It features an intuitive and user-friendly user interface that allows precise programming and real-time monitoring of the assembly process. Its sophisticated control machine ensures precise and repeatable control of the precise temperature, time and pressure parameters required for efficient seating of the device. The core component of Eagle 60 Standard is its thermally controlled bonding chamber. This state-of-the-art module offers precise temperature control from room temperature down to 0°C, using dual-zone controls. This ensures precise, repeatable and consistent temperature control for the entire cycle time. The integrated real-time thermocouple displays the temperatures with real-time accuracy. Additionally, the device offers a variable pressure proportional control to ensure proper force is applied to the assembly. ASM Eagle 60 Standard features advanced bonding solutions suitable for a wide variety of applications. This includes underfill adhesives, die attach and plastic substrate bonding as well as wire bonding, thermal transfer bonding and others. The tool is suitable for assemblies requiring tight joint control and repeatability, while its built-in vacuum asset prevents bubbling during the bonding process. In conclusion, Eagle 60 Standard is an advanced and versatile bonding model suitable for a wide variety of applications. It provides intuitive controls with precise temperature, time, and pressure control for optimal device attendance. Its simple yet highly efficient design ensures consistent performance and output quality, resulting in reliable and cost-effective bonding solutions.