Used ASM Eagle 60 #293595625 for sale

Manufacturer
ASM
Model
Eagle 60
ID: 293595625
Vintage: 2004
Wire bonder 2004 vintage.
ASM Eagle 60 is a fully automated wire bonder for mid-scale production of microelectronics. It features an advanced control system that can handle the precise production of high-density applications. Eagle 60 comes with an easy to use GUI for setting up each process. ASM Eagle 60 offers a variety of bonding techniques, including Gold Wire Thermosonic Ball and Wedge Bonding, Thermal Compression Bonding, Ultrasonic Bonding and Aluminum Bonding Process. This allows it to be used in a variety of applications, including ball and wedge bonds, interconnects, die attach, fine pitch and more. Eagle 60 also supports a variety of specialized processes including gold material up-bonding and RFID parts. ASM Eagle 60 can bond wires with a range of sizes and materials, up to 4 mils in diameter and up to 0.002 inches in length. It also offers the option of full-loop bonding with all types of wire materials. The process can easily be adjusted to the desired parameters, resulting in highly precise bonds with a consistently high degree of quality. Eagle 60 is also equipped with several advanced features for achieving superior performance and reliable operation. The integrated vision system allows for automatic rewiring and bonding, ensuring the highest accuracy and repeatability with each bond. The integrated algorithm constantly monitors and reports on the bond, ensuring that each assembly is produced to specification. ASM Eagle 60 has a modular design, making it easy to add or remove parts and customize the machine to your exact application needs. The compact and easy-access design of Eagle 60 also makes it easy to maintain and clean. It also features an intuitive, user-friendly interface and advanced diagnostics to help minimize downtime. All in all, ASM Eagle 60 is an efficient and reliable wire bonder offering superior precision, reliability and cost-effectiveness. It is ideal for production of complex microelectronic structures and advanced applications.
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