Used ASM Eagle 60 #293595882 for sale

ASM Eagle 60
Manufacturer
ASM
Model
Eagle 60
ID: 293595882
Vintage: 2003
Wire bonder 2003 vintage.
ASM Eagle 60 is a fully automated, modular thermal equipment designed to perform advanced wafer and die bonding operations. It is the ideal system for high-volume production, delivering fast cycle times and maximum throughput. The unit features a multiple-head, multi-axis motion configuration for ultra-precise alignment, eliminating the need for manual adjustment. Its temperature control and precision motion machine enable small-feature sized die, enabling chip-level assembly. The tool offers high flexibility and advanced process control capabilities, allowing for ideal adjustments and repeatable processes. A range of bond heads is available with specified size, force, and mechanical travel requirements. The asset can bond thermocompression and thermosonic processes, as well as advanced differences. It also offers a variety of modes for non-contact wafer-level bonding, including pressure-assisted and high-force applications. Eagle 60 offers an array of features designed to provide reliability, repeatability, and scalability. Process parameters can be stored in ASM Eagle 60's memory, allowing for easy adjustments and a library of processes. The integrated vision model provides real-time, high-resolution viewing and analysis of critical processes, while embedded EtherCAT communication offers industrial-grade control. The multi-head operation greatly reduces cycle times. Eagle 60 is equipped with a range of safety features to ensure reliable operation and maximum uptime. It features several anti-vibration mechanisms, active leveling, and force monitoring. The integrated vision equipment also includes a range of tools for peak detection and fault detection. A unique "learn" function allows the system to learn from feedback and adjust parameters as needed, ensuring stability and repeatability. All in all, ASM Eagle 60 is a comprehensive, industrial-grade thermal unit designed for fast, reliable, and repeatable die and wafer bonding operations. Its multiple-head, multi-axis motion machine provides ultra-precise alignment and its range of features maximize process control and uptime.
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