Used ASM Eagle 60 #293603972 for sale

ASM Eagle 60 is a bonder specifically designed for the needs of high-precision microelectronic assembly. This fully automated, closed loop machine ensures consistent accuracy and fast throughput when bonding semiconductor wafers and components. Eagle 60 comes with a two-stage ultrasonic bonding process. First, it bonding heads press the bond material onto the substrate with a low pressure, gentle ultrasonic force applied from the outside. This is followed by a high pressure, high frequency torsional wave which applies the upper acoustic field aspect. This process delivers both physical and electrical bonds through the full contact area and quickly welds thin, fragile gold wire to the surface without heating or damaging the substrate. ASM Eagle 60 has an integrated automatic substrate feeder and a fully automated wafer handling equipment. The wafers are loaded onto the left-hand side and the components are fed through the right-hand side. The wafers can be programmed to move to match the components before and during the bonding process. Eagle 60 is equipped with a three-axis (X, Y and Z) motion control system that provides precise control while maintaining accuracy even during the high-speed bonds. It also has a vision-guided alignment unit that allows for the fine-tuning of each bond. ASM Eagle 60 has user-friendly software interface and a built-in video magnification machine that makes alignments easier to implement. Eagle 60 also has an integrated microprocessor-controlled safety tool that monitors and detects any potential safety issues. ASM Eagle 60 is a great bonding tool for the microelectronics assembly industry. Its wide range of features and technologies make it a reliable partner for all your electronic bonding needs.