Used ASM Eagle 60 #293656032 for sale

Manufacturer
ASM
Model
Eagle 60
ID: 293656032
Vintage: 2005
Wire bonder 2005 vintage.
ASM Eagle 60 is a fully automated, desktop, wedge and ball wedge bonder offering the highest quality and precision for a wide range of bonding applications. Eagle 60's features and capabilities make it an ideal choice for those working with both large and small volumes of product. The equipment is highly reliable and repeatable for perfect repeatability and reproducibility. This allows for repeatable results and a more efficient assembly line process. It also has an adjustable temperature control system to provide consistent and optimal heating for bond materials. This is especially important for high-precision micro-assembly. ASM Eagle 60 has a number of advanced features that enable precise and accurate bond placement. The unit's patented wafer to wafer alignment allows for precise wafer placement and its low-vibration movements ensure accuracy. It is also equipped with ESD protection from static discharges. Eagle 60 has an intuitive, user-friendly graphical interface that enables easy programming and control of the machine. In addition, the tool is compatible with a range of bond materials including gold, aluminum, copper, and lead-tin alloys. The asset's vision model additionally helps to ensure the exact placement of each bond. The equipment is capable of bonding at a rate of 60 wafers per hour, making it one of the fastest and most productive bonders on the market. ASM Eagle 60 also has an auto-calibration mode and an automatic wire-end inspection feature to ensure uniform results and consistent wire-end quality. Eagle 60 also has a number of safety features to protect the operator and the product, including door interlocks, keypads and LED status indicators. Additionally, the system is backed by a comprehensive service plan, making it easy to maintain and repair if necessary. The unit is also supported by a range of accessories such as a bonder gun, stand and other accessories. to manage and customize the bonding process.
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