Used ASM Eagle 60 #293656033 for sale

ASM Eagle 60 is a mid- to high-end semiconductor die bonder that is designed to offer superior performance and accuracy for piece-by-piece die to substrate attachment. Eagle 60 utilizes a robust design that is equipped with an intuitive graphical interface, and provides performance critical to facilitate efficient and effective design optimization of complex assembly variables. ASM Eagle 60 operates with an open frame structure and is driven by a high-precision equipment comprised of a wafer vision system, a wire bonding unit and a controller platform. Eagle 60 is designed for the exacting needs of semiconductor packaging, providing a large manipulation arm and a precision drive machine for controlled motion of die and substrates over the bond area. This enhances accuracy and precision when mounting dies and substrates, and helps ensure optimal die placement and bond strength. ASM Eagle 60 is equipped with a wafer vision tool that can image full-frame images of only the wafer area of interest, or single images of full-frame wafers or dies. The asset can detect for profiling of height and pitch corrections, as well as detect specular and normal reflections, thus maximizing the die attachment process. Eagle 60 also utilizes a wire bonding model that allows for a wide range of wires to be used with the equipment, with each wire optimized for its specific application and operating environment. ASM Eagle 60 is also designed for maximum speed and efficiently, with an automated, "one-stop" process that includes automatic nozzle cleaning, thermal equlization, and a real-time monitoring process that can detect and isolate die defects. This ensures that only quality die and substrates are utilized within the attachment process, and with the use of advanced die-for-die bond engineering, total system cycle times can be reduced dramatically. Finally, Eagle 60 is designed for high-reliability operations, providing an integrated warning unit that can alert the operator to any potential errors or malfunctions that occur during the die bonding and attachment process. ASM Eagle 60 is an excellent choice for automated die bonding operation that offers superior performance and accuracy.