Used ASM Eagle 60 #293669760 for sale

ASM Eagle 60 bonder is an automated semiconductor assembly equipment designed for high volume manufacturing. It is equipped with an intuitive user interface and offers programmable control of multiple parameters for precise positioning and optimized results. The system features advanced process control capabilities including the use of a standard recipe library, data logging, and programmable production time and temperature settings. Eagle 60 has eight independent bonding platforms, allowing users to quickly set up the device for several different applications. The platforms can be configured with a range of bonding heads and the machines are designed to accommodate both manual and automated wire bonding processes. Each platform is equipped with a high-performance Eutectic or Ultrasint bonding head for advanced performance and precision. ASM Eagle 60 has an integrated chip placement unit, which utilizes either vacuum or pin placement to accurately position devices for bonding. The configuration also allows for the automation of material handling, data acquisition, and other manufacturing processes. Eagle 60 is designed for a wide range of applications, including the production of QFN and PTQ packages, LED's, and fine-pitch devices. The machine also includes custom-designed process modules for a variety of user requirements. It is also suitable for production of devices with built-in protection circuits, as ASM Eagle 60 has an optional on-board application for monitoring of defects. The machine also comes with a powerful set of data analysis tools that enable users to quickly identify and analyze issues as they arise. Eagle 60 is a versatile assembly device that provides users with a secure, repeatable, and reliable process for high volume production. Its intuitive user interface, adjustable recipe library, and on-board application offer reliable performance while minimizing the need for skilled personnel. ASM Eagle 60 is an ideal choice for manufacturers looking for a compact, easy to use, and versatile assembly device for use in high volume semiconductor manufacturing.