Used ASM Eagle 60 #9111645 for sale

ASM Eagle 60 is an automated thermosonic ball bonding equipment used in the manufacture of advanced electronic components. Designed for high-precision and safe operation, it is one of the most reliable and efficient wire bonding machines available in the market today. The main components of Eagle 60 include a bond head mechanism, control unit, programmable logic controller (PLC), vision system, and wire alignment unit. The bond head consists of two electrodes that move along the X-Y axes and provides a static electric current allowing the heat required to melt and coalesce the gold bond wire to the substrates. Built with selectable program settings and multiple bond head parameters, the bond head can adjust pitch, access, wire size, and wire angle according to specific production requirements. The Eagle's control unit is equipped with multiple CPUs, providing an ideal platform for data communication and software programming. Depending on the desired production speed, users can select from three operation modes: single operation, double operation, and simultaneous operation. Additionally, the PLC provide logic commands and process data for control applications. ASM Eagle 60 features a comprehensive vision machine with detecting, sorting, and analyzing capabilities. The tool is used to inspect the bond wire for true or false defects, such as defective joints, missing wires, and off-axis defects. The wire alignment asset is designed to ensure proper bond alignment and proper wire feed to the bond head. Finally, Eagle 60 is a reliable and efficient production model that offers precise bonding control. As a result, it is ideal for high-volume manufacturing of electronic components such as multilayer ceramic capacitors, resistors, inductors, and the like. It offers great adaptability, high bonding speeds, and superior performance. With accurate temperature control, ASM Eagle 60 allows the user to customize the load, speed, and temperature according to the exact needs of any production application.