Used ASM Eagle 60 #9118778 for sale

ASM Eagle 60 is an automated top side bonder specifically designed for die attach applications in the semiconductor and photonics industries. This model has a reliable, precision-based dual-arm design that allows for quick, accurate placement of any bond type. It features a 12" X 12" working area and can accommodate substrates up to 5x the size of the die, and up to 0.02mm inHeight. Eagle 60 is a state-of-the-art bonding equipment that comes equipped with advanced, integrated smart technologies such as SoftwareVision™, Auto-Process™, and Process Verification System (PVS). SoftwareVision™ was developed for the Eagle to accurately identify die size and orientation, as well as select the correct bonding tool, making the unit both versatile and efficient. Auto-Process™ allows for a user-friendly and intuitive platform that automates the bond process within the given parameters. The Process Verification Machine (PVS) is an integrated, double check tool that inspects the die orientation, die attach location, and die height before moving onto the next cycle. This helps ensure improved product reliability and yields. ASM Eagle 60 is programmed with precision-based motion control capabilities designed specifically for die attach operations. The asset operates with a two-axis and maintains constant velocity and acceleration cycles to increase process stability and die placement accuracy. The Eagle also features a modular design with adjustable dispenses that reduce bonder setup time and shrink die attach cycle times. Eagle 60 is a reliable, ergonomic, and innovative model capable of producing consistent, reproducible bonds with improved die attach precision. It is an ideal solution for a wide range of die attach applications in the semiconductor and photonics industries, and is sure to be a valued addition to any manufacturing facility.