Used ASM Eagle 60 #9119594 for sale

ASM Eagle 60 is an advanced thermocompression bonder designed for high precision, high speed, and optimal quality bonding for microelectronic and optoelectronic applications. The bonds are formed via electrically induced thermocompression which makes it suitable for attaching non-compatible materials, requiring minimal surface preparation. Eagle 60 has a wide variety of design features to make bonding easier, including a highly accurate and repeatable electrical control system, a large working area, multiple bond head configurations, and a range of compatible solders. ASM Eagle 60 features a full range of adjustable power, preheating, and other bonding parameters to suit any bonding application. It has a maximum power output of 600 W and an adjustable preheat temperature range from 180 - 420° C. The power and preheat settings can be set for optimal performance, reducing voids and bridging of interconnects. It also has a large working area, accommodating boards up to 200 x 200mm in size. This is ideal for larger components, as well as multi-lane attachment. Additionally, Eagle 60 contains automatic die bond head detection, as well as 4 separate vacuum zones for delamination avoidance. ASM Eagle 60 comes with a variety of accessory options that can be used for custom attachment needs. These that include flex bond assemblies, tabond heads for thin film attachment, and general bondheads for Au/Sn soldering. The general bondhead can apply solder paste or solder wire directly to the bond area with a precision of +/- 2μm, for high precision and accuracy. Additionally, the automated die bonder attachment allows for quick and repeatable die attach, with consistent bond loop heights that ensure reliability over time. Eagle 60 also features a dual-dieform camera vision system to ensure accurate position alignment and tight control over the bond loop, as well as an automatic thermal shutoff to protect against temperature overshoot or loss of bond integrity due to flux sublimation. The alarm and data logging functions of ASM Eagle 60 allow for easy troubleshooting and analysis of the failed bond loops, enabling the user to quickly address any issues and reduce cost due to rework and/or scrap. By leveraging all of these features, Eagle 60 offers the highest levels of precision and quality for any thermocompression bonding application.