Used ASM Eagle 60 #9124545 for sale

ASM Eagle 60 is an automatic metallographic bonding equipment designed for precision bonding applications such as semiconductor device packaging and substrate interconnection. The system is loaded with cutting-edge technology to provide reliable, reproducible bonding results. The unit is composed of three main components: a power supply, a controller, and a wafer stage. The power supply provides a DC or pulsed DC current to the bonder. The controller is used to control the parameters of the bonding process, such as current, pressure, and temperature, as well as the duration and sequence of processing operations. The wafer stage is used to rotate the wafer and precisely position the bonder head relative to the wafer. The bonder head contains an inert gas chamber, an inert gas inlet port, and an electron beam gun. The gas chamber is used for purging the wafer's surface prior to bonding and for controlling the amount of heat generated by the electron beam gun, which is used for bonding operations. The inert gas inlet port provides a supply of absorbed gas, such as fluorine and nitrogen, which is essential for preventing oxidation during bonding. Eagle 60 is equipped with a high-precision tracking machine to enable accurate control of the bonding process. The tool uses linear feedback control algorithms to control the electron beam gun's position and the position of the wafer platform. This ensures that the wafer is aligned properly and that the bonding process proceeds without any error or disruption. ASM Eagle 60 is a highly reliable, accurate, and easy to use metallographic bonding asset. Its specialized capabilities make it an ideal choice for a wide range of semiconductor device packaging and substrate interconnection applications.