Used ASM Eagle 60 #9145250 for sale

ASM Eagle 60 is a high-performance medium volume automated bonder developed and manufactured by ASM Pacific Technology. The bonder is designed for use in a wide variety of applications, including die attach, tab PC boards turning, semiconductor packages, connectors, and various intricate shapes. Eagle 60 is a fully automated equipment utilizing advanced technologies such as vision inspection, die handling, high precision motion control and advanced bond monitoring systems. ASM Eagle 60 is designed to deliver mass-produced, high-quality results with minimum downtime and low manufacturing costs. The system is capable of accurately handling a variety of die sizes and materials, including active and passive components. The unit is capable of handling lead spacings ranging from 0.2 mm to 1.3 mm, package sizes from 8x8 mm to 60x60 mm, and package thickness from 0.3 mm to 2.5 mm. It also supports multiple die placements including 1D, 2D, and 3D die placement. Eagle 60 also features advanced motion control, allowing fine positioning of the die and substrate during the bonding process. It includes two high-precision die bonds and one substrate bond, providing excellent registration and accuracy. The machine also features a vacuum tool for accurate handling of the substrate and die. ASM Eagle 60 is equipped with a heated bond head that can be programmed for specific bonding parameters. Eagle 60 includes an intuitive, graphical user interface that allows the user to easily select and set up bonding parameters. It also includes a fully integrated asset monitoring model that provides real-time feedback on equipment status and performance. Overall, ASM Eagle 60 is an advanced automated bonder designed for high-volume production of complex parts. It offers high accuracy, precision, and control, and is capable of handling a variety of materials and package sizes. The system's advanced features make it an ideal solution for a wide range of applications.