Used ASM Eagle 60 #9166797 for sale
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ID: 9166797
Vintage: 2005
Wire bonder
Interface: ASM
Application: SOIC Package
Power requirement: 220VAC, 1 Phase
Bonding system:
Bonding method THERMOSONIC (TS)
BQM Mode:
Constant current, voltage, power and normal (Programmable)
Loop type: Normal, low, square, penta, J, VLED, FLEX
XY Resolution: 0.2 μm
Z Resolution (Capillary travelling motion): 0.4 μm
Fine pitch capability: 35 μm pitch @ 0.6 mil wire
(3000) Bonding wires
Program storage: 1000 Programs on hard disk
Multi mode transducer system:
Programmable profile
Control / Vibration modes
Vision system:
Pattern recognition time: 60 ms / point
Pattern recognition accuracy: + 0.37 μm
Lead locator detection: 12 ms / lead (3 leads/frame)
Lead locator accuracy: + 2.4 μm
Post bond inspection: First bond, second bond / Wire tracing
Maximum die level different: 400 – 500 μm
Material handling system:
Indexing speed: 200 – 250 ms @ 0.5" pitch
Indexer resolution: 1μm
Lead frame position accuracy: + 2 mil
Applicable lead frame:
W: 24 - 73 mm @ bonding area in Y = 65 mm
24 - 90 mm @ bonding area in Y = 48 mm
L: 280 mm (Maximum)
T: 0.075 - 0.8 mm
Applicable magazine:
W: 98 mm (Maximum)
L: 140 - 280 mm
H: 180 mm (Maximum)
Magazine pitch: 2.4 - 10 mm (0.09” - 0.39“)
Device changeover: < 4 minutes
Package changeover: < 5 minutes
Number of buffer magazine: 3 (Maximum 435 mm)
Facilities:
Voltage: 110 VAC
Voltage tolerance: ± 10 %
Frequency: 50 Hz
Frequency tolerance: ± 1 %
Phase: Single
Compressed air: 152 LPM maximum at 3 - 6 bar
Power consumption: 1500 W
Operating condition:
Ambient temperature: 5 °C to 40 °C
Humidity: < 80 %
Attitude: 1000 m above sea level
2005 vintage.
ASM Eagle 60 is a state-of-the-art bonder for for precision interconnect assembly applications. It is designed to provide quick, precise, and reliable bond results for a variety of materials including gold, aluminum, tin, copper, and quartz. With its expanded user interface displays, Eagle 60 delivers faster setup and optimization. In addition, its touch screen interface makes it easy to use and allows the user to quickly adjust parameters to optimize results. ASM Eagle 60 is capable of wirebonding, wedge and stitch bonding, and fine pitch ballbonding. It has temperature controlled bond heads and quick change head mechanisms for easy and accurate setup and repeatability. The dual force monitor technology allows for finely tuned force control and precise end results. It is capable of working with a wide range of wire diameters for precise bonding of fine wire leads as thin as 0.001 inches in diameter. Eagle 60 also has selectable laser adjustment for very precise alignment of the wire. This ensures accurate lead forming and encapsulation and improved wire bond integrity. The integrated vision system allows for fast inspection of bonds at high speeds and resolutions up to 10 microns. Additionally, the bonder has advanced motion control and integrated programmability for custom programmed operation and automated adjustment of settings during process runs. ASM Eagle 60 has an enclosed cabinet design which reduces dust, fumes, and noise. It also boasts safety features such as dual beam safety guarding, accessible emergency stop buttons, and a safety interlock door switch. Additionally, the bonder has robust temperature control, capable of temperatures ranging from ambient to up to 240 degrees Celsius. In summary, Eagle 60 is a reliable and effective bonder engineered for precision and accuracy. It offers advanced features such as dual force monitor technology, selectable laser adjustment, vision system, motion control, temperature control, and safety interlocks. Its user-friendly interface, quick setup, accurate positioning and repeatability make it an ideal choice for many interconnect assembly applications.
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